Study of Thin Film Copper Electrodeposition on Carbon Substrate for Thin Film Battery Electrode Application

  • Nurul Huda Sanat Universiti Tun Hussein Onn Malaysia
  • Muhammad Muhammad Nmaya Universiti Tun Hussein Onn Malaysia
  • Muhammad Jibrin Isa Universiti Tun Hussein Onn Malaysia
  • Mohammed Isah Kimpa Universiti Tun Hussein Onn Malaysia
  • Mohd Arif Agam Universiti Tun Hussein Onn Malaysia
Keywords: The electrodeposition of copper onto carbon substrate was studied in 0.5 M of CuSO4 solution at various applied voltages, 2.0, 4.8 and 6.0 V. The electrodeposition was carried in an electrochemical cell with copper as the anode and carbon as the cathode.

Abstract

The electrodeposition of copper onto carbon substrate was studied in 0.5 M of CuSO4 solution at various applied voltages; 2.0, 4.8 and 6.0 V. The electrodeposition was carried in an electrochemical cell with copper as the anode and carbon as the cathode. The influence of electrodeposition parameters on the thickness of deposits and surface roughness of copper films were studied in detail using Atomic Force Microscopy (AFM). The current value increases with the increasing of applied voltage. Charge-discharge test was performed in 0.5 M and 1.0 M of HCl, and revealed that high concentration of electrolyte resulted high surface roughness and thickness of copper film.

 

Author Biography

Mohd Arif Agam, Universiti Tun Hussein Onn Malaysia
Associate Professor Dr
Published
20-05-2016
How to Cite
Sanat, N. H., Nmaya, M. M., Isa, M. J., Kimpa, M. I., & Agam, M. A. (2016). Study of Thin Film Copper Electrodeposition on Carbon Substrate for Thin Film Battery Electrode Application. Journal of Science and Technology, 8(1). Retrieved from https://publisher.uthm.edu.my/ojs/index.php/JST/article/view/1242