Mazlan, Muhammad Dinie, and Hasliza Hassan. “Non-Destructive Test for IC Package With 8D Report”. Evolution in Electrical and Electronic Engineering 3, no. 1 (June 15, 2022): 044–052. Accessed May 3, 2024. https://publisher.uthm.edu.my/periodicals/index.php/eeee/article/view/6676.