MAZLAN, Muhammad Dinie; HASSAN, Hasliza. Non-Destructive Test for IC Package With 8D Report. Evolution in Electrical and Electronic Engineering, [S. l.], v. 3, n. 1, p. 044–052, 2022. Disponível em: https://publisher.uthm.edu.my/periodicals/index.php/eeee/article/view/6676.. Acesso em: 3 may. 2024.