Bachok, Zuraihana, Universiti Sains Malaysia
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International Journal of Integrated Engineering Vol. 10 No. 5 (2018): Special Issue 2018: Mechanical Engineering - Special Issue 2018: Mechanical Engineering
Structural Assessment of Lead Free Solder Joint of Miniaturized Electronics Assembly
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International Journal of Integrated Engineering Vol. 13 No. 7 (2021): Special Issue on Mechanical Engineering - Articles
Structural Analysis and Material Characterization of Silver Conductive Ink for Stretchable Electronics
Abstract PDF