1.
Saad AA, Bachok Z, Che Ani F, Jalar A, Abas MA. Structural Assessment of Lead Free Solder Joint of Miniaturized Electronics Assembly. ijie [Internet]. 2018 Nov. 19 [cited 2024 May 3];10(5). Available from: https://publisher.uthm.edu.my/ojs/index.php/ijie/article/view/2548