Liu, Chia-Hao, Hsien Chung, Ren-Kai Lu, Ben-Je Lwo, Tom Ni, and Alice Pan. 2022. “Glass-Embedded Fan-Out Antenna-in-Packaging for 5G Millimeter Wave Applications”. International Journal of Integrated Engineering 14 (6): 216-22. https://publisher.uthm.edu.my/ojs/index.php/ijie/article/view/9668.