LIU, Chia-Hao; CHUNG, Hsien; LU, Ren-Kai; LWO, Ben-Je; NI, Tom; PAN, Alice. Glass-Embedded Fan-Out Antenna-in-Packaging for 5G Millimeter Wave Applications. International Journal of Integrated Engineering, [S. l.], v. 14, n. 6, p. 216–222, 2022. Disponível em: https://publisher.uthm.edu.my/ojs/index.php/ijie/article/view/9668.. Acesso em: 18 jul. 2024.