Liu, C.-H. ., Chung, H., Lu, R.-K., Lwo, B.-J., Ni, T., & Pan, A. . (2022). Glass-Embedded Fan-Out Antenna-in-Packaging for 5G Millimeter Wave Applications. International Journal of Integrated Engineering, 14(6), 216-222. https://publisher.uthm.edu.my/ojs/index.php/ijie/article/view/9668