Kornain, Z., Jalar, A. and Rasid, R. (2010) “The Investigation of Die Back Edge Cracking in Flip Chip Ceramic Ball Grid Array Package (FC-CBGA)”, Journal of Science and Technology, 2(1). Available at: https://publisher.uthm.edu.my/ojs/index.php/JST/article/view/240 (Accessed: 7 May 2024).