KORNAIN, Z.; JALAR, A.; RASID, R. The Investigation of Die Back Edge Cracking in Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). Journal of Science and Technology, [S. l.], v. 2, n. 1, 2010. Disponível em: https://publisher.uthm.edu.my/ojs/index.php/JST/article/view/240. Acesso em: 4 jun. 2023.