The Investigation of Die Back Edge Cracking in Flip Chip Ceramic Ball Grid Array Package (FC-CBGA)

  • Zainudin Kornain
  • Azman Jalar
  • Rozaidi Rasid
Keywords: FC-CBGA, Die Edge Crack, Underfill Fillet, Thermal Stress, Underfill Properties

Abstract

The cracking between die back edge and top fillet for Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to thermal cycling have been investigated in this study. Finite Element Analysis (FEA) model was used to analyze the effect of fillet geometry and material properties of underfill upon stresses along the die back edge. The thermo-mechanical properties of commercial underfill were obtained by using Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA) as the input for the simulation. Die stress distribution for different fillet height and width were generated to depict variation of stress due thermal loading and the variations of tensile stress were discussed for parameter optimization. The effect of different underfill material properties were discussed as well for thermal stress reliability improvement.

Author Biographies

Zainudin Kornain
Institute of Microengineering and Nanoelectronics (IMEN)
bSchool of Applied Physic, Universiti Kebangsaan Malaysia
43600 UKM, Bangi, Selangor, Malaysia
Azman Jalar
Institute of Microengineering and Nanoelectronics (IMEN)
bSchool of Applied Physic, Universiti Kebangsaan Malaysia
43600 UKM, Bangi, Selangor, Malaysia
Rozaidi Rasid
Institute of Microengineering and Nanoelectronics (IMEN)
bSchool of Applied Physic, Universiti Kebangsaan Malaysia
43600 UKM, Bangi, Selangor, Malaysia
How to Cite
Kornain, Z., Jalar, A., & Rasid, R. (1). The Investigation of Die Back Edge Cracking in Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). Journal of Science and Technology, 2(1). Retrieved from https://publisher.uthm.edu.my/ojs/index.php/JST/article/view/240
Section
Articles